Modern integrated microelectronic devices are often poorly repairable and difficult to recycle. Debondable adhesives play a ...

Knowing the force required to progressively separate two bonded, flexible adherends gives engineers an understanding of the direct measure of the adhesive bond strength in a bonded joint.

When testing the strength of the new methods, the researchers involved found that when they snapped the bond, the adhesive ...

Gap fill is the spacing or gap between the substrate that the cyanoacrylate adhesive can accommodate and still maintain a functional, full strength bond. The ultimate tensile strength (UTS) is the ...

bond-line thickness, etc.). Testing is important in all aspects of materials science and engineering, but it is especially so in adhesives. Such tests evaluate not only the inherent strength of the ...

This bioinspired adhesive, using fluororubber and carbon nanotubes, withstands temperatures over 200 Celsius while providing ...

A new environmentally friendly adhesive polymer has been developed by bioengineers at the University of California, Berkeley.

The low process temperatures and nearly instant cure allow these substrates to be finished without damage to the substrate. The webinar will begin with an overview of UV cured powder coating, ...

Modern integrated microelectronic devices are often poorly repairable and difficult to recycle. Debondable adhesives play a key role in the transition to a circular economy with sustainable resources, ...